ENZON Semiconducto、Wafer film laminator, wafer bonder, substrate film laminator, film transfer machine, wafer cleaning machine, custom non-standard automation equipment and equipment modification, committed to providing customers with professional solutions and high-performance semiconductor equipment.

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Hesheng Semiconductor · Smart Manufacturing Future

Focus on wafer mounting machines, temporary bonding/debonding, substrate mounting, customization and modification of automation equipment, etc.

enzon-semiconductor equipment · Smart Manufacturing Future

Focus on wafer mounting machines, temporary bonding/debonding, substrate mounting, customization and modification of automation equipment, etc.

Hesheng Semiconductor · Smart Manufacturing Future

Focus on wafer mounting machines, temporary bonding/debonding, substrate mounting, customization and modification of automation equipment, etc.

ABOUT US

Suzhou Ensong Semiconductor Technology Co., Ltd

Suzhou Ensong Semiconductor Technology Co., Ltd. is an excellent enterprise in the research and manufacturing of semiconductor equipment in China. In the intelligent equipment manufacturing industry, we specialize in wafer laminating machines, temporary wafer bonding/debonding machines, substrate laminating machines, film pouring machines, wafer cleaning machines, customized non-standard automation equipment, and automation transformation fields. We are committed to providing customers with professional solutions and high-performance semiconductor equipment……

Business philosophy: people-oriented, honest and pragmatic, mutually beneficial
Enterprise tenet: Survival through quality, development through service
Corporate culture: Diligent, rigorous, truth-seeking, and pragmatic
Corporate vision: To become a leading global semiconductor equipment manufacturer.

Focus on intelligent equipment

Leader in Domestic Semiconductor Equipment Manufacturing

Business Scope

Focusing on semiconductor equipment, wafer film lamination, temporary bonding/debonding, custom automation equipment transformation, and other fields.

Product Center

Fully automatic wafer laminating machine (before BG thinning)

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Fully automatic wafer laminating machine (pre plating)

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Fully automatic wafer laminating machine (before cutting)

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Temporary Bonding/Debonding Series
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Temporary Bonding/Debonding Series

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Upholding the philosophy of 'Continuous Innovation, Leading the World,' we adhere to a customer-centric approach, swiftly responding to customer needs, and consistently creating long-term value for our clients.

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Service Support

Upholding the philosophy of "Continuous Innovation, Leading the World," we adhere to a customer-centric approach, swiftly responding to customer needs, and consistently creating long-term value for our clients.

The company brings together a team of senior engineers in the field of semiconductor equipment R&D, possessing extensive experience and reliable core technologies in products such as semiconductor equipment development and automated equipment transformation.

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technological innovation

The company brings together a team of senior engineers in the field of semiconductor equipment R&D, possessing extensive experience and reliable core technologies in products such as semiconductor equipment development and automated equipment transformation.

Film Application Series

Temporary Bonding Series

Automation Series

Film Lamination Field

Temporary Bonding Field

Automation Field

Marketing Network

Technology Innovation