ENZON Semiconducto、Wafer film laminator, wafer bonder, substrate film laminator, film transfer machine, wafer cleaning machine, custom non-standard automation equipment and equipment modification, committed to providing customers with professional solutions and high-performance semiconductor equipment.

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Film Lamination Series

Wafer laminating machine (before BG thinning)

Wafer laminating machine (before chemical plating)

Wafer laminating machine (before cutting)

Wafer pouring machine (facing and changing)

Wafer film tearing machine

Substrate laminating machine
Temporary Bonding/Debonding Series

Full-automatic temporary bonding machine

Full automatic UV debonding machine

Full-automatic laser debonding machine

Thermo-sliding debonding machine
Automation Transformation

Automation Transformation

Wafer Edge Finding Module (Aligner)

Robot (Robot)

Custom Non-Standard Automation Equipment and Transformation

Company Profile

Qualifications and

Honors

Film Application Series

Temporary Bonding Series

Automation Series

Film Lamination Field

Temporary Bonding Field

Automation Field

Marketing Network

Technology Innovation

Contact Information

Online Message

Cooperation Hotline: 400-900-1877

Working hours: 09:00-18:00

Film Lamination Series

Wafer laminating machine (before BG thinning) Wafer laminating machine (before chemical plating) Wafer laminating machine (before cutting) Wafer pouring machine (facing and changing) Wafer film tearing machine Substrate laminating machine

Temporary Bonding/Debonding Series

Full-automatic temporary bonding machine Full automatic UV debonding machine Full-automatic laser debonding machine Thermo-sliding debonding machine

Automation Transformation

Automation Transformation Wafer Edge Finding Module (Aligner) Robot (Robot) Custom Non-Standard Automation Equipment and Transformation

Cooperation Hotline: 400-900-1877

Wafer laminating machine (before BG thinning)

Wafer laminating machine (before chemical plating)

Wafer laminating machine (before cutting)

Wafer pouring machine (facing and changing)

Wafer film tearing machine

Substrate laminating machine

Full-automatic temporary bonding machine

Full automatic UV debonding machine

Full-automatic laser debonding machine

Thermo-sliding debonding machine

Automation Transformation

Wafer Edge Finding Module (Aligner)

Robot (Robot)

Custom Non-Standard Automation Equipment and Transformation