Loading and unloading module (load port)

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Product Series

Film Lamination Series

Temporary Bonding/Debonding Series

Automation Series

Fully automatic wafer laminating machine (before BG thinning)

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Fully automatic wafer laminating machine (pre plating)

Fully automatic wafer laminating machine (pre plating)" src="http://jso5c644f.pic15.websiteonline.cn/upload/693f8ee2b08fe.jpg?_t=1765773026" class="pro9proimg coverMode">

Fully automatic wafer laminating machine (before cutting)

Fully automatic wafer laminating machine (before cutting)" src="http://jso5c644f.pic15.websiteonline.cn/upload/693d31d25afd3.jpg?_t=1765618130" class="pro9proimg coverMode">

Fully Automatic Wafer Laminating Machine (Before Substrate Thinning)

Fully Automatic Wafer Laminating Machine (Before Substrate Thinning)" src="http://jso5c644f.pic15.websiteonline.cn/upload/693d32256265e.jpg?_t=1765618213" class="pro9proimg coverMode">

Fully Automatic Wafer Film Flipping Machine (Flip and Change Film)

Fully Automatic Wafer Film Flipping Machine (Flip and Change Film)" src="http://jso5c644f.pic15.websiteonline.cn/upload/693d32e4310e1.jpg?_t=1765618404" class="pro9proimg coverMode">

Substrate film coating equipment

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Fully automatic temporary bonding equipment

Fully automatic temporary bonding equipment" src="http://jso5c644f.pic15.websiteonline.cn/upload/69411be48506f.jpg?_t=1765874660" class="pro9proimg coverMode">

Fully automatic UV debonding equipment

Fully automatic UV debonding equipment" src="http://jso5c644f.pic15.websiteonline.cn/upload/694218d105657.jpg?_t=1765939409" class="pro9proimg coverMode">

Fully automatic laser debonding equipment

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Company Profile

Qualifications and

Honors

Film Application Series

Temporary Bonding Series

Automation Series

Film Lamination Field

Temporary Bonding Field

Automation Field

Marketing Network

Technology Innovation

Contact Information

Online Message

Cooperation Hotline: 400-900-1877

Working hours: 09:00-18:00

Yue ICP No. 2024315505